Solder the gold balls in place. Place a dangle component on the soldering block concave-side up. Lightly flux the interior of the small inner component, and place the gold ball within, pre-soldered-side down.
With your torch, gently warm up the assembly until the flux stops bubbling, and check the position of the ball. The ball may jump around because of the bubbling solder; if necessary, use your solder pick to reposition the ball so the solder is down.
Heat the assembly, avoiding the thin bail, until the solder flows and joins the gold ball to the dangle component. You may have to use your soldering pick to hold the ball in place .
Quench, pickle, and rinse the dangle. Check that the ball and component are joined securely; re-solder as necessary. Repeat to attach the other dangle component’s gold ball.
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